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Symposium on PCBs to be held in Shenzhen

Posted: 05 Oct 2006 ?? ?Print Version ?Bookmark and Share

Keywords:electronics components? PCBs? circuit? printed circuit? electronics component?

The Association Connecting Electronics Industries and the China Printed Circuits Association will hold the third Global Board Technology symposium entitled "Working Together to Advance Industry Capability" next week in Shenzhen, China. The symposium will be open to all PCB manufacturers, EMS, OEMs, ODMs, material suppliers and equipment makers.

Representatives from members of the IPC OEM Workgroup Committee, including Intel Corp., IBM Corp., Hewlett-Packard, Dell Inc. and Texas Instruments, will discuss the future needs for PCB technology R&D, and expansions of assembly and test manufacturing. The symposium intends to impart industry surveys and results of test studies to help improve the industry's PCB fabrication capabilities.

The symposium will also hold an open forum on technology trends, process and material challenges and other key industry issues. This event will run from October 13 to 14.

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