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RTP system eases shift to single-wafer processing

Posted: 09 Oct 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Mattson? Atmos? rapid thermal processing? rapid thermal oxidation? RTP?

Mattson Technology Inc. is extending its rapid thermal processing (RTP) technology into the growing rapid thermal oxidation (RTO) market with the latest addition to its family of advanced RTP solutions.

Built upon the Helios platform, Atmos is a dual-chamber, single-wafer 300mm RTP system for high-volume chip manufacturing through the 32nm technology node. Designed to address the industry's transition to single-wafer processing for applications currently predominantly run on furnaces, explained Mattson, Atmos enables a broad range of RTO applications, including selective oxidation and shallow-trench isolation.

Atmos offers improved oxidation capabilities compared to dry oxidation and in-situ steam generation. This solution's model-based temperature measurement and control system allows precise control across the wafer and repeatable results from wafer-to-wafer, enabling customers to fabricate thin, uniform oxides.

Featuring an integrated pyrogenic water-vapour generator, Atmos enables a broad range of concentrations of reactive species at lower thermal budgets, resulting in higher processing flexibility for shallow-trench isolation liner processes. The system also features a dedicated edge grip and edge support end-effecter for superior backside particle performance and on-the-fly wafer alignment for higher throughput. The system's modular, dual-chamber platform is designed for ease of use and maintenance and high reliability, critical factors in 300mm volume production environments.

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