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Qimonda hands 80nm DRAM tech to Winbond

Posted: 16 Oct 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Qimoda? Winbond? DRAM? 80nm DRAM? Taiwan?

Qimonda AG and Taiwan foundry Winbond Electronics Corp. have extended their DRAM manufacturing partnership. The new agreement calls for Qimonda, the DRAM spin-off of Infineon Technologies AG, to transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung, Taiwan. In return, Winbond will manufacture DRAMs for computing applications in this technology exclusively for Qimonda.

The companies say the expansion of the process technology transfer to 80nm is an important step in maintaining a close collaboration in the future.

Infineon and Winbond signed pacts in 2002 and 2004 on the transfer and licensing of 110nm and 90nm DRAM technologies for Winbond's 200mm plant in Hsinchu, Taiwan, and 300mm plant in Taichung.

The German memory maker has access to five major manufacturing sites on three continents: in Richmond, Virginia, United States; Dresden, Germany; and another site in Taiwan that Qimonda operates as part of a joint venture with Inotera. And in addition to the foundry agreement with Winbond, the company employs China's Semiconductor Manufacturing International Corp. to make some of its parts.

"The extension of our cooperation with Winbond underlines our partnership commitment in Asia and it further increases our production capabilities and flexibility," said Kin Wah Loh, CEO of Qimonda.

Qimonda announced its long-awaited IPO in early August.

- John Walko
EE Times-Europe

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