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Optimal announces enhancements to SiP analysis suite

Posted: 19 Oct 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Optimal? SiP Analysis Suite? Apache Design? signal integrity? power analysis?

Many tools support signal-integrity or power analysis for chips, packages or boards individually, but analyzing them all together is a challenge. Optimal Corp. this week will announce chip/package/PCB co-design support in the form of enhancements to its Optimal SiP Analysis Suite for system-in-package (SiP) design.

Initially rolled out in June, the SiP Analysis Suite supports 3-D signal-integrity, power and thermal analysis of SiPs, including stacked bare dice, package-in-package, package-on-pack- age and wire-bonding schemes. It claims tight integration with Cadence Design Systems' RF SiP Methodology Kit and was, in fact, introduced at the same time, with support from Cadence.

The Optimal SiP Analysis Suite includes PakSi-E, a quasi-static extraction and analysis tool for signal and power integrity; O-Wave, a full-wave 3-D electromagnetic analysis tool for high-frequency signals; PowerGrid, a power integrity solution for DC IR drop and AC impedance over frequency; and PakSi-TM, a thermal/mechanical analysis system.

Apache Design's RedHawk-EV
One new capability is integration with Apache Design Solutions' RedHawk-EV power analysis tool. According to Optimal CEO Dave DeMaria, users can now export a package model from the Optimal environment into RedHawk, so designers can analyze a chip's power and signal integrity with an accurate package model. That integration was accomplished through a common customer, DeMaria said.

Another new capability makes it possible to combine the SiP, package and board together as one model, with a common meshing approach that provides unified signal, power and simultaneous-switching-noise model generation. Users can then do extraction and analysis on the combined system.

"People have been breaking up jobs according to the physical boundaries of the system, but the electrical boundaries are different," said Jamie Metcalf, VP of business development at Optimal. "Only by analyzing two things together can you truly get all of the interactions that are going on."

A third new capability is dynamic IR visualization. By providing a minimum/maximum voltage contour map for the board, it lets users locate the minimum and maximum voltages, determine resonances and decide where to place decoupling capacitors, Metcalf said.

In addition to Cadence's Allegro environment, the Optimal SiP Analysis Suite works within package and board design environments from Synopsys, Mentor Graphics and Zuken. The suite starts at $65,000. The new capabilities will be available at the end of October.

- Richard Goering
EE Times




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