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Sensors/MEMS??

Dongbu, Silicon File collaborate on image sensor devices

Posted: 06 Nov 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Dongbu Electronics? Silicon File? image sensor?

Dongbu Electronics has collaborated with Silicon File Technologies, a Korean fabless company specializing in CMOS Image Sensor (CIS) design, to develop a new process that can implement 5Mpixel CIS devices at the 130nm node.

Instead of using 7-to-8 layers of copper wiring commonly used in processing wafers at the 130nm node, the new process deploys a 3-layer aluminum interconnect structure. As a result, the CIS devices implemented with the new process are expected to cost less to produce without compromising performance. Moreover, Silicon File's shift from a 0.18?m to a 130nm process is expected to result in further cost savings as more than 30 percent more CIS chips can be produced per wafer.

According to Dr. Jae Song, EVP of Dongbu, the new 5Mpixel CIS process announced was preceded by the company's development of a 2Mpixel CIS process at the same 130nm node. He confirmed that Dongbu continues to aggressively expand its portfolio of intellectual property and design libraries, both through internal development and third parties, to make its CIS wafer processing technologies "second to none."

"We have clearly positioned Dongbu Electronics as a technology leader in specialized CIS processing that enables the implementation of high resolution CIS devices at very competitive price points," said Song. He noted that the company is targeting early 2008 to qualify a CIS process at the 110nm node for volume production.

Demand for 2Mpixel CIS devices is forecast to more than double from about 130 million units in 2006 to about 350 million units in 2007, while demand for CIS devices specifying 4Mpixel or more are expected to command more than half of the entire market in 2009.




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