TSMC invests $1.1B in 90-, 65nm

Taiwan Semiconductor Manufacturing Co. (TSMC) approved a plan to spend $1.1 billion to expand 65nm and 90nm process capacity at its 300mm wafer fabs.

The spending, approved by its board of directors, is part of its overall budget plan for the year. For 2006, the silicon foundry's capital expenditures are expected to be in the range of $2.6 to $2.8 billion.

The company also said it would spend $9.2 million to expand its 1? high-voltage process capacity in Fab 2. In addition, it will spend $73 million to increase its stake by 6.8 percent in Systems on Silicon Manufacturing Company Pte. Ltd (SSMC), a joint venture it runs in Singapore. After the purchase, it will own 38.8 percent of SSMC.

This is the second time this year TSMC has funneled money into 65nm and 90nm capacity. In May, TSMC approved a plan to spend $966.3 million at its 300mm facility (Fab 14) in the Tainan Science Park in southern Taiwan. It also said at the time it would spend $242.1 million to expand production at the company's 6- and 8-inch wafer fabs.

More recently, during a board meeting in August, TSMC also approved a spending plan of $190.1 million for the expansion of its 8-inch fab capacity and its 0.11?, 3D one-time program process. The company also planned to expand its 0.18?m and 0.15?m processes, as well as 6- and 8-inch epitaxy process capacity.

- Mike Clendenin
EE Times