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TI chip makes multimedia phones affordable

Posted: 13 Nov 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? OMAP-Vox? OMAPV1035? eCosto? DRP?

Texas Instruments Inc. (TI) has announced a new OMAP-Vox single-chip solution that will enable lower-cost multimedia-rich feature phones. Codenamed "eCosto," the new single-chip platform leverages TI's DRP technology. The first product in the eCosto platform is OMAPV1035, which will be manufactured in 65nm and will support GSM, GPRS and EDGE standards.

eCosto represents the latest advancement in TI's integrated DRP technology, a pioneering approach to wireless chip design which applies digital technology to simplify RF processing in advanced CMOS process technology. Integrating the RF transceiver and analog codec with the digital baseband reduces board space, extends battery life and makes for a more powerful and versatile handset.

With OMAPV1035, customers currently using TI's LoCosto platform and OMAP-Vox processors will be able to easily expand their handset portfolio with competitive, affordable multimedia-rich handsets. As the current OMAPV1030 and new OMAPV1035 solutions share a common software platform, OMAP-Vox customers will be able to reuse their application and modem software investments for faster and more cost-effective multimedia-rich feature phone development.

"As the emerging markets evolve beyond voice-centric, basic multimedia applications, we must support the integration of more advanced multimedia features into our single-chip cellphone solutions," said Alain Mutricy, TI's VP and general manager of cellular systems solutions for its wireless terminals business unit. "Now ramping into mass production with LoCosto solutions, we are taking our DRP single-chip technology to the next level with the eCosto platform, dramatically lowering system costs of advanced multimedia handsets."

eCosto capabilities include advanced video capture, playback and streaming with up to QVGA screen quality at 30fps; digital still camera up to 3Mpixels with sub-second shot-to-shot delay; color LCD; and interactive 2D/3D gaming with graphics comparable to that of portable video consoles. The OMAPV1035 solution touts high-speed hardware-accelerated Java and 3D graphic processing up to 100-K polygons-per-second. TI said this solution is the industry's first ARM9 fully integrated single-chip digital baseband with DSP in 65nm, addressing the power challenge for performance-hungry multimedia-intensive applications, as well as the requirement for smaller solutions with more functionality.

The OMAPV1035 single-chip solution will sample in Q1 2007 and will be in production in 2008. More information on the OMAPV1035 solution is available at TI.

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