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Altera, WEDC collaborate on FPGA packaging for military use

Posted: 22 Nov 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Altera? White Electronic Designs? FPGA? OEMs? packaging?

Altera Corp. and White Electronic Designs Corp. (WEDC) will collaborate on a slew of packaging options for FPGAs for military applications. This is said to be the 'first' cooperative packaging agreement of its kind in the programmable logic industry.

"This relationship further demonstrates Altera's commitment to defense electronics OEMs," said Jack Bogdanski, director of marketing for defense microelectronics products at WEDC. "It brings FPGA capabilities to military systems designers in smaller form-factor packaging for applications requiring greater density and design flexibility than standard packaging allows."

WEDC will package Altera's FPGA die in formats that will include small form-factor monolithic plastic and ceramic, chip-on-board, multichip modules, stack and system-in -package. The packaging options will support Altera's 90nm Stratix II and Cyclone II FPGA families. Support for Altera's next-generation, 65nm FPGAs is also planned.

"Altera's relationship with White Electronic Designs expands our range of packaging options well beyond the competition's and is a further demonstration of our enhanced COTS [commercial off-the-shelf] initiative," said Don Faria, senior VP of Altera's business groups. "Offering small form-factor monolithic packaging more effectively aligns us with the needs of our military and aerospace customers."

Altera's COTS approach to the military/aerospace market includes providing devices that support a range of temperature gradients, bare die business support, long-term obsolescence protection and a consistent supply chain.




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