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Wire-bondable devices come in silicon and ceramic

Posted: 24 Nov 2006 ?? ?Print Version ?Bookmark and Share

Keywords:TT electronics? IRC? Advanced Film Division? WBC? resistors?

IRC's WBC family of wire-bondable devices

TT electronics IRC Advanced Film Division has developed a comprehensive range of surface-mount wire bondable devices. Designated the WBC series, the family consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic.

According to Debasis Roy, thin film business unit director for IRC Advanced Film Division, IRC has its own complete in-house silicon production capabilities. "While most manufacturers produce devices on either silicon or ceramic, IRC manufactures both," said Roy.

Unless otherwise noted, the devices in the wire bondable family feature absolute tolerance to 0.1% (ratio tolerance to 0.05%), absolute TCRs to 25ppm/C and TCR tracking to 5ppm/C. Due to their small size and stability, the wire bondable devices are being specified for use in hybrid modules as well as for applications involving implantable medical electronics and other battery-operated miniature devices.

Pricing for the wire bondable resistors, capacitors, divider networks and network arrays ranges from 80 cents to $5, depending on device, in quantities of 1,000 pieces. Lead time is from stock to 14 weeks.




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