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New microscope enables atomic-scale wafer analysis

Posted: 05 Dec 2006 ?? ?Print Version ?Bookmark and Share

Keywords:FEI? transmission electron microscope? Helios NanoLab? TEM? wafer analysis?

FEI Co. will unveil a family of transmission electron microscopes (TEM) that it says will enable atomic-scale imaging and analysis of semiconductor wafers.

FEI's Helios NanoLab 400S will be showcased at Semicon Japan this week (Dec. 6-8). The Helios NanoLab is a family of dual-beam TEMs.

A focused ion beam on the NanoLab can cut tiny slivers out of wafers without destroying adjacent chips. The sliver can then be analyzed by the scanning electron beam, enabling layers of a semiconductor wafer to be imaged as a cross-section.

FEI claims the TEM improves imaging resolution by 40 percent over previous models. Low-voltage scanning electron microscope resolution has also been improved, the company claims, for cross-sectional imaging, thereby enabling semiconductor materials at sub-65nm design nodes to be more easily analyzed.

- R. Colin Johnson
EE Times




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