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UMC, Integrand expand collaboration to 90nm, 0.13?m RFCMOS

Posted: 12 Dec 2006 ?? ?Print Version ?Bookmark and Share

Keywords:RFCMOS? RF/mixed mode IC? 90nm? 0.13µm? UMC?

EDA software company Integrand Software Inc. and United Microelectronics Corp. (UMC) announced that their ongoing collaboration has resulted in new advances and enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13?m nodes.

According to the press release, Integrand's EMX and EMX-Continuum tools have been used to create scalable models for metal-oxide-metal (MOM) capacitors and inductors. These scalable models are linked to the Integrand's Optimum Capacitor Finder (OCF) and Optimum Inductor Finder (OIF), and are now being distributed as part of UMC's Foundry Design Kit (FDK).

"We have been very happy to expand on our relationship with UMC to provide new design tools and accurate models for RFCMOS designers," said Dr. Sharad Kapur, president of Integrand. "The scalable models of inductors and capacitors now cover both 0.13?m and 90nm technologies. The new scalable models for UMC's MOM capacitors and the associated OCF represent a unique solution for the capacitor synthesis problem."

Model accuracy has been verified to be within a few percent of measurements for inductance and capacitance, as well as for more sensitive parameters such as quality factor (Q), the companies said. In addition, an interface has been built within the UMC FDK for direct access to the EMX simulation engine. This not only gives designers the ability to simulate components from UMC's library in the true circuit context, surrounded by other components and interconnects, but also allows designers to perform their own custom designs using UMC certified process technology files and Integrand's EMX.

Additionally, Integrand's OCF, a GUI-based synthesis tool, is now deployed within the FDK to allow UMC customers to enter their desired capacitance and make tradeoff decisions between Q and area. These models are accurate and validated by measurements on silicon wafers, the companies said. The models also include the effects of dummy fill and substrate coupling. Similar to OIF, the seamless integration of OCF within the FDK allows for back annotation in order to drive UMC's Schematic Driven Layout.

"The integration of the OIF and OCF into our Foundry Design Kits, along with the silicon verified scalable component models, provides a unique industry solution by allowing our customers to directly synthesize optimal passive components like inductors or capacitors within seconds. The efficiency with which our customers can now design and implement their circuits should dramatically reduce time-to-market for their products," said Dr. Long-Ching Yeh, vice president of design tool support and DFM for UMC's system and architecture support division.

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