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AMD goes 'green' with Pb-free bumping tech

Posted: 21 Dec 2006 ?? ?Print Version ?Bookmark and Share

Keywords:lead-free? green products? Pb-free bumping technology? Advanced Micro Devices? AMD?

Advanced Micro Devices Inc. (AMD) has entered into an agreement to license Amkor Technology Inc.'s Pb-free electroplated wafer bumping technology. Terms of the license agreement were not disclosed.

The electronics industry is striving to reduce or eliminate certain elements and compounds, such as lead, mercury, cadmium and halogen, in favor of "green" products in response to legislation in Europe and Japan.

Wafer bumping is the process of depositing tiny solder "bumps" onto fabricated semiconductor wafers and is a key step in creating flip chip-based IC packages. The growing adoption of flip chip packaging, coupled with the "Green" electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology.

The semiconductor industry is steadily migrating from high-lead alloy formulations to a Tin-Silver alloy as the "solder of choice" for electroplating bumps onto semiconductor wafers.

"As one of the first microprocessor manufacturers to innovate with lead-free bumping technology, AMD is continuing its track record of environmental responsibility and customer-centric thinking in how we produce our products," said David Bennett, vice president of strategic manufacturing and alliances at AMD, in a statement.

"AMD's decision to license our Unitive lead free bumping technology is an indication of Amkor's technological leadership in advanced packaging applications," said Oleg Khaykin, executive vice president and COO of Amkor, in a statement. "We are currently in discussion with other companies to foster broader industry adoption and support of our advanced wafer-level packaging technology."

- Richard Goering
EE Times

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