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Toshiba offers four NAND flash solutions

Posted: 10 Jan 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Toshiba? TAEC? NAND flash?

From $6.3 billion in 2006, the market for embedded NAND is projected to hit $12.9 billion in 2010, including NAND used in multichip package solutions for cellphones. To address this rapidly growing market, Toshiba America Electronic Components Inc. (TAEC) is rolling out four embedded NAND solutions developed by Toshiba Corp. These include GB NAND, LBA-NAND, GB MCP and Package-on-Package (PoP) technology.

GB NAND is a single-component solution combining a memory controller with an SD interface, error correction code (ECC), wear-leveling and block management with MLC NAND flash memory.

Also a single-component solution, LBA-NAND combines high-density MLC NAND and a memory controller with logical block addressing, ECC, block management and a standard NAND interface. The resulting device is a simple write/read memory that enables virtually seamless integration of MLC NAND into new or existing embedded flash applications that support SLC NAND, enabling access to greater storage capacities and improved cost/performance for consumer applications.

GB MCP is a multichip package (MCP) memory. In addition to standard MCP memory devices such as NAND plus SDRAM or NOR plus PSRAM, this solution integrates a gigabyte or larger NAND flash memory with an SD card interface controller for high-density data storage applications such as camera- and MP3-equipped cellphones.

PoP technology is a modified MCP that cuts circuit board space in cellular handsets and other mobile devices by stacking a high-density memory component on top of the processor so the two components require only one footprint on the board. Toshiba is offering low power SDRAM and high-density NAND flash PoP configurations in 14-by-14mm and 15-by-15mm PoP packages.

"As NAND advances to smaller process geometries at 56nm and below, embedded designs will need to address higher levels of ECC, wear-leveling functions and other NAND management capabilities," said Scott Nelson, director, memory marketing at TAEC. "Each of these self-contained MLC NAND solutions with on-board controllers eliminates the need for host software drivers and memory management functions, and helps speed time to market for our customers."

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