Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

Assembling high-Pb DS2761 flip-chips in a Pb-Free assembly flow

Posted: 02 Jun 2006 ?? ?Print Version ?Bookmark and Share

Keywords:lead? Pb? European Union? Restriction of Hazardous Substances Directive? RoHS?

This application note details the Pb-free assembly process used for DS2761 flip-chip die, and the reliability stresses encountered after the assembly.

View the PDF document for more information.

Article Comments - Assembling high-Pb DS2761 flip-chips...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top