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Assembling high-Pb DS2761 flip-chips in a Pb-Free assembly flow

Posted: 02 Jun 2006 ?? ?Print Version ?Bookmark and Share

Keywords:lead? Pb? European Union? Restriction of Hazardous Substances Directive? RoHS?

This application note details the Pb-free assembly process used for DS2761 flip-chip die, and the reliability stresses encountered after the assembly.

View the PDF document for more information.



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