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CMD, SPEL collaborate on small profile packages

Posted: 26 Jan 2007 ?? ?Print Version ?Bookmark and Share

Keywords:California Micro Devices? CMD? SPEL Semiconductor? leadless molded package? small profile packages?

California Micro Devices (CMD) announced it has completed a joint agreement with SPEL Semiconductor to expand the capacity of SPEL's Leadless Molded Package (LMP) lines and add support for two new additional small profile packages. CMD will contribute approximately $2.2 million of the total estimated $7.75 million joint investment required for the capacity expansion to support the additional lines.

According to the press release, the demand for the company's mobile protection products in small profile, leadless packages has increased dramatically with the growing popularity of thin profile mobile handsets and other small portable devices such as portable media players, MP3 players and digital cameras and camcorders. The agreement with SPEL provides CMD a cost effective expansion of its assembly capacity as it increases its penetration into this growing segment of the mobile protection market. The two new lines will provide assembly capacity for the company's products utilizing TLMP and uTLMP packages.

"SPEL's technology and manufacturing capabilities are complementary with our strategy to package our mobile handset protection products in the smallest footprints and lowest profiles," said Robert V. Dickinson, CMD president and CEO. "We look forward to expanding upon our relationship with SPEL as we collaborate to bring up the new LMP lines this year."




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