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Elpida-PSC JV ramps 70nm production

Posted: 30 Jan 2007 ?? ?Print Version ?Bookmark and Share

Keywords:DRAM? 70nm? Elpida? Powerchip? Rexchip?

Joint venture partners Elpida Memory Inc. and Powerchip Semiconductor Corp. (PSC) will commence business in April, aiming to launch manufacturing operations with a 70nm process by this summer.

"We named the joint venture Rexchip, which symbolizes our ambition to become the king of the DRAM arena," said Yukio Sakamoto, president and CEO of Elpida.

With the combined capacity of the JV along with separate foundries operated by PSC and China's Semiconductor Manufacturing International Corp., Elpida expects that its total monthly capacity will reach 240,000 300mm wafers by 2008. "If the capacity expands to this level, we can aim for the top position or the second in the market," said Sakamoto.

Sakamoto emphasized that the JV's competitiveness was strongest in the 70nm DRAM chip market. Elpida launched volume production of 512Mbit and 1Gbit DRAMs using the 70nm process at its Hiroshima fab last December.

In Q3 of 2007, Elpida said it expects to reach a monthly capacity of 20,000 wafers for 70nm fabrication. By December, the capacity will be ramped up to 70,000 wafers a month. Rexchip Electronics Corp. will seek to fabricate 30,000 wafers using the 70nm process by December. Elpida will acquire the half of the output.

Additionally, Elpida will expand its 300mm wafer fabrication capacity from 120,000 wafers a month to 170,000 wafers a month by December. Sakamoto estimated that about 60 percent of its DRAMs are fabricated with 300mm wafers. Both companies are aiming for the largest 300mm wafer capacity in the industry, he said.

Rexchip is located in Houli, Taiwan, and is evenly owned by Elpida and PSC. Output will also be evenly divided between the partners.

- Yoshiko Hara
EE Times




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