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Advanced package-stacking fits more functions

Posted: 01 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Z-Ball Stack package assembly process? package stacking process? package stacking techniques? BGA package technology? silicon packaging?

The primary benefit in multiple-die packaging is the dramatic increase in component density. The size and weight of the product is likely to be reduced and functionality enhanced. The functional enhancement is achieved through the integration of several device types.

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