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Korean IC firm adopts SEZ's Da Vinci tools for DRAM

Posted: 02 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:SEZ Group? DRAM? memory? Da Vinci? polymer removal?

The SEZ Group announced that a major Korean semiconductor manufacturer has placed a multiple-system order for SEZ's Da Vinci family of tools for back-end-of-line (BEOL) polymer removal for 300mm and 200mm memory devices with sub-90nm process technologies.

The four-system order will be used for aluminum copper polymer cleans for next-generation DRAM devices and will utilize SEZ's dilute sulfuric-peroxide (DSP+) chemistry process.

According to the company, this order win is a significant milestone for as it marks its entry into this memory manufacturer's production line for BEOL cleans.

Chief operating officer for SEZ Asia Pacific, Herwig Petsching said "It not only opens the door to a new customer in the Korean market, but also further validates the Da Vinci's ability to continuously meet our customers' needs both in cost of ownership and performance."

The Da Vinci platform was developed through close collaboration with key customers, the platform combines a flexible, multi-chamber architecture with a very small footprint to deliver high throughput and accuracy, while maintaining optimal system uptime. Specifically, utilizing an acidic aqueous solution like DSP+ for DRAM processes eliminates cleaning problems typically caused by solvent-based polymer removers, which is particularly critical as device geometries continue to shrink and delivery windows tighten.

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