Spansion announces transition to 300mm flash

Spansion Inc. announced its Submicron Development Center, its R&D headquarters, has successfully completed its transition from 200mm to 300mm.

The company claims that it is the only Silicon Valley company that has 300mm flash memory in development and possesses the only 300mm R&D facility in California. Spansion will transfer the 300mm process to its new SP1 300mm manufacturing facility as it comes on line in Japan.

By late 2007 Spansion plans to be producing 65nm MirrorBit flash memory devices at its new SP1 300mm wafer manufacturing facility in Aizu-Wakamatsu, Japan, followed by 45nm in production by mid 2008.