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Samsung steps up heat dissipation in LCD TVs

Posted: 05 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Samsung? LCD TV? DDI?

Samsung Electronics Co. Ltd announced what it touts as the industry's 'first' thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs. The DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.

A typical DDI requires at least 15V of power to drive large, high-resolution LCD TV panels operating on broad frequency spectrums to reproduce high-speed video images. This generates greater heat for the DDI, which then causes reliability problems.

Samsung has developed a new material for the thin metal tape component that has optimal properties to effectively maximize heat dissipation. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying the TECOF package, the thermal emissions from the DDI are quickly released via the metal tape, thus minimizing heat buildup.

Moreover, heat build-up limits the number of channels that a single DDI chip can cover, creating an obstacle to reducing the total number of DDI per panel. Using the TECOF package, the number of source DDIs for a full-HD LCD TV is reduced from fourteen 414 channel-DDIs to eight 720 channel-DDIs.

"Package technology has become an important element, along with circuit design, in the development of DDIs for large-screen LCD TVs," said Sa yoon Kang, vice president for Samsung's System LSI division. "With the development of TECOF package, we propose the new standard for DDI product and solidify our global leadership position in developing display driver ICs for the LCD market."

Beginning this second quarter, Samsung will ship its DDI product with the TECOF package technology.

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