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BGA header improves electrical performance

Posted: 08 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:BGA? backplane header? BAG headers? FCI? connectors?

FCI has expanded its AirMAX VS connector system by offering a BGA attachment option for backplane headers. By combining FCI's proven BGA technology with its shieldless high-speed connector design, the AirMax VS vertical BGA headers offer improved electrical performance including lower insertion loss and better impedance match through the footprint by reducing signal reflection.

The AirMax VS vertical BGA header connector is initially available in configurations providing 10 columns with 15 contacts per column, supporting five differential pairs per column, with either 2mm or 3mm column spacing. These five-pair versions provide high signal density, accommodating 63 differential pairs or 95 single-ended signals per inch.

No major redesigns
Suitable for applications requiring components to be mounted on both sides of the backplane, the BGA termination option is also said to optimize footprint, via and routing options; maximize advanced PCB manufacturing techniques by using buried and micro-vias; reduce layer count and applied cost and eliminate major backplane redesigns.

The elimination of metal shields is said to result in a lighter connector with fewer termination points. In addition, by using air as the dielectric between adjacent conductors, the AirMax VS connector system offers high-speed computing and networking system designers high signal density and the industry's lowest insertion loss and crosstalk, without the use of space-consuming and costly metal shields, said the company.

Easy migration
In addition, the Insert Molded Leadframe Assembly (IMLA) used in AirMax VS connectors enable the same connector to be used for differential pair, single-ended or power signals. The design also allows systems to migrate from 2.5Gbps to 25Gbps without requiring a redesign of the basic platform.

The AirMax VS connector family offers a complete system of modular building blocks including signal connector options that scale among 3, 4 or 5 differential pairs per column along with complementary power and guide modules to support backplane, co-planar, I/O cabling and mezzanine board-stacking applications.

- Gina Roos
eeProductCenter




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