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Server-class COM features advanced Intel chips

Posted: 19 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:processor? DDR memory? computer-on-module? Intel? Adlink?

Adlink Technology Inc. showcased two new members of its computer-on-module (COMs) line at the Embedded World 2007 in Germany. The ETXexpress-IW400 and ETXexpress-DW400 modules are targeted at high-performance data streaming applications such as data communications, telecommunications, storage, display processing and video acquisition.

The ETXexpress-IW400 is based on a Dothan Intel Celeron M or Pentium M processor combined with Intel's new 3100 chipset for high bandwidth applications. The ETXexpress-DW400 offers identical functionality but is able to support higher-performance processors such as Intel Core Duo and Intel Core2 Duo. The form factor and pin out of both modules are fully compliant with the PICMG COM Express Basic form factor, type 2 specification.

Server-class functions
Both modules are based on the Intel 3100 that combines server-class memory and I/O controller functions into a single component, creating the first integrated Intel chipset specifically optimized for embedded, communications and applications requiring high bandwidth. The ETXexpress-IW400 and ETXexpress-DW400 modules can support either a single PCIe x8 lane with four x1 lanes or two PCIe x4 lanes with four x1 lanes. The modules provide both PCI and LPC busses, four serial ATA and 1 PATA port, one Intel GbE, four USB 2.0 ports and a serial debug port. Memory is either supported as a single horizontal SO-DIMM socket, or two vertical SO-DIMM sockets to achieve a maximum capacity of up to 4Gbyte DDR2 memory.

The PICMG COM Express modules embody the convergence of the latest technology standards based on serial differential signaling such as PCIe, USB 2.0, serial ATA, LVDS and serial DVO. These standards are implemented on a 95-by-125mm compact COM. Signals are brought out through two 220-pin board-to-board connectors that permit data transmission rates of up to 5GHz. Six mounting holes connect the module with a custom-made, application specific carrier boards which provide protection from shock and vibration.

Shorter time-to-market
The modular concept of off-the-shelf core modules combined with custom-made carrier boards reduces customers' time-to-market and allows them to focus on their core competitiveness. Adlink currently offers several types of ETX modules that are PCI/ISA-based COMs for low- to medium-level performance and the new ETXexpress line for cutting-edge performance based on the PCIe bus.

"Besides being a leading designer and manufacturer of COM-related products, Adlink has the additional advantage that it can offer expertise in high-speed DAQ, motion control, machine vision and image acquisition for carrier board development," says Henk van Bremen, product director of embedded computing at Adlink. "Combining these qualities can result in exiting solutions for OEM customers in such key areas as test and measurement, video acquisition and HD video manipulation and streaming."

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