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New platform rolls for in-line 3-D SMT inspection

Posted: 22 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:inspection? 3-D SMT?

SVS Ascent 3-D SMT inspection platform from GSI Group

GSI Group Inc. is unveiling a completely new platform for in-line, 3-D SMT inspection of solder paste depositions and component placement for process control. Promising a new level of speed, accuracy and flexibility, the SVS Ascent improves 3-D SMT inspection in terms of price-over-performance for boards up to 50.8-by-61cm.

Based on a modernized platform, the SVS Ascent features the Gen4 all-solid-state laser scanning platform with an 8MHz DAQ rate, all-digital processing and 8X oversampling. The Gen4 imaging system is built on the SVS patented laser scanning and triangulation technique. The data acquired by the Gen4 is analyzed pixel by pixel, without merging or blending areas of acquired data, resulting in highly accurate 3-D inspection results, distilled in real-time into easy-to-use process data.

The SVS Ascent also provides streamlined programming, which allows panel set-up from CAD data within 10mins. In the absence of CAD data, manual programming ability allows for creation of new programs or the editing of existing programs. Only SVS offers this range of programming options.

The SVS Ascent is said to be the most robust solution for SMT inspection available today. It detects flaws in volume, area, height, X/Y position, coplanarity and bridging. It can handle odd-shaped parts, call up inspection programs from bar code data, connect to SPC software for data analysis, automatically compensate for board warpage and provide consistent results regardless of changes in lighting or board color.




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