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Talks bring key industry issues to forefront for mainland EEs

Posted: 28 Feb 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Infineon Technologies? Micrel? SigmaTel? IC design? chip design?

SigmaTel's James Wong will discuss the trends in media players and multimedia phones.

The 12th International IC-China Conference & Exhibition (IIC-China), to be held in Shenzhen, Beijing and Shanghai on March 5-14, will be offering mainland China engineers the chance to interact and discuss key issues with both major industry players and peers in the form of Summits and Vendor Seminars. The objective of these lectures is to bring to design engineers valuable information that will help them influence product development in China.

The theme of this year's series of Summits is "Going portable: Challenges and opportunities." The Shenzhen leg will kick off on March 6 at the Shenzhen Convention & Exhibition Center with a talk from Infineon Technologies' Matthias Ludwig, VP and managing director of Infineon Center of Competence Shanghai Co. Ltd. Titled "Reducing design complexity with higher integration," Ludwig will focus on trends and growth drivers for the communications market and discuss how China players can lower entry barriers through progressive and smart chipset integration. James Wong, marketing director of Asia at SigmaTel Asia Ltd, and Richard Lo, China/Hong Kong country manager of Micrel Inc., will also tackle trends in media players and multimedia phones, and power challenges in next-generation handsets, respectively.

Richard Lo of Micrel will tackle power challenges in next-generation handsets.

Lo will be reprising his talk on handset power management at the China World Hotel in Beijing on March 9. Altera Corp.'s lecture, "Aiming for a world without wires," will be given by Tim Colleran, VP of the broadcast, automotive and consumer business units. Due to increasing demands for lower cost, higher levels of functionality and smaller form factors, engineers are facing bigger challenges in minimizing power consumption and board space. Colleran will discuss how these constraints can be met without sacrificing innovation. In line with this, Gweltaz Toquet, VP of Asia sales for CEVA Inc., will be talking about programmable software solutions for overcoming challenges in innovation and reusability at both the Beijing and Shanghai venues.

Also speaking at the Shanghai Mart in Shanghai on March 14 is Paul PG Zhang, director of customer support for Greater China at NXP Semiconductors. His lecture will touch on the proliferation of handheld devices, the convergence of telecoms and the Internet, and the new applications that will be emerging in China with the approach of the 2008 Olympics in Beijing. Sam Wong, director for the Asia Pacific region at Tensilica Inc., will also discuss programmable approaches to adding A/V functionality to SoC designs at the same venue.

Face-to-face interaction
Meanwhile, vendors will be presenting their solutions to designers in face-to-face sessions at the IIC-China Vendor Seminars. These comprehensive presentations will focus on how vendor solutions address design and technology challenges faced by engineers in mainland China. Demonstrated solutions will fall under categories that run the gamut of industry segments: digital consumer electronics, telecom infrastructure, wireless communications, embedded systems, power management, automotive electronics, analog design and EDA tools.

NXP's Paul Zhang will talk about the new apps that will emerge with the approach of the 2008 Olympics.

For digital CE, Spansion Inc.'s "Choosing the right MP3/MP4 solutions to achieve effective cost structure and best performance" will tackle how the company's S2100 and S3100 series can enable China's MP3/MP4 manufacturers to deliver differentiated products and branch into segments beyond, such as GPS systems and multimedia phones. For telecom infrastructure, ON Semiconductor's "Very low-noise operation of crystal oscillator circuits using a PLL-based technology" will present how a high-order PLL-based frequency synthesis IC can improve phase-noise power density, frequency stability, long-term aging and mechanical integrity. In wireless communications, Optichron Inc.'s "New technology eliminates nonlinear distortion, improves system performance" will present the company's Turbolinear signal- processing technology and its benefits in ADC module solutions.

Meanwhile, Atmel Corp. will tackle embedded power management by presenting its picoPower technology, which uses techniques that eliminate unnecessary power consumption in power-down modes to provide multiyear battery-life in applications such as lighting control, security, keyless entry and Zigbee. Also aimed at power management is Texas Instruments' presentation, which will discuss Impedance Track, a technology that accurately predicts the battery's remaining capacity to extend runtime for single-cell Li-ion battery applications in handsets.

Touching on the growing segments in Asia, Freescale Semiconductor will present "Total solution for automotive" to introduce the company's 8-, 16- and 32bit automotive MCUs and analog/sensor products for cars, while Analog Devices Inc.'s "Analog ICs in modern medical systems" will discuss the challenges in designing high-performance analog front-ends for electrocardiographs and ultrasound equipment. Altium Ltd will present its Altium Designer 6 EDA tool, which brings hardware, software and programmable hardware development together in one environment, allowing all aspects of deign to be done in a single system.

- Selena Salang
Electronic Engineering Times-Asia

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