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Winbond unrolls parallel, serial flash devices

Posted: 01 Mar 2007 ?? ?Print Version ?Bookmark and Share

Keywords:flash memory? parallel? serial? Winbond? Winstack?

Winbond Electronics Corp. has announced three new parallel flash memory devices in its W19B product familythe W19B160B, W19B320B and W19B640Cand two new serial flash memory devices in its SpiFlash W25X familythe W25X16 and W25X32. The new devices use the company's Winstack process technology.

70ns random access
The W19B160B and W19B320B offer 16Mbit and 32Mbit densities, respectively, which support x8/x16 data width and random access speed of 70ns under 2.7V-3.6V operation voltage. Features include erase suspend/erase resume, top or bottom boot block, write-protection and hardware reset. The 32Mbitit W19B320B also offers a security sector to protect critical code of customers. Both are suitable for DVD players and recorders, MP3 players, printers, networking devices, STBs, projectors and automotive, CE, gaming and mobile applications.

The W19B640C offers 64Mbit density. On top of the features of W19B320B, the W19B640C also supports 20ns page mode access speed and flexible bank architecture, which is for simultaneous read/write operation. This parallel flash is suitable for consumer applications like digicams, DVD recorders, STBs (DVB-C), high-end networking applications and low-cost handset. All devices in the W19B family are JEDEC-compatible in package/pinouts and command sets.

Highest-density serial flash
The W25X16 and W25X32 offer 16Mbit and 32Mbit densities, respectively, that fit in space-saving and cost-effective 8-pin 5.3mm SO8 package, making them the highest-density serial flash memories available in this small form factor, according to Windbond.

Similar to the company's W25X10/20/40/80 (1-8Mbit SpiFlash memories), the W25X16 and W25X32 feature high performance and flexible 4Kbyte erasable sectors throughout the memory array. The packaging, performance and flexibility of these serial memory devices make them suitable for a wide range of electronic applications including DVD drives and recorders, desktop and notebook PCs, WLAN devices, DSL modems, printers and cordless phones.

High-density serial flash memories (16Mbit and greater) are commonly packaged in the larger and more costly 16-pin 7.6mm SO16 with 8-unused pins. W25X16 and W25X32 are available in an 8-pin 5.3mm SO8 that uses half the space of a 16-pin SOIC, resulting in smaller and simpler PCBs. The SO8 package also allows for a common footprint from 4Mbit to 32Mbit densities.

Double data rate
The W25X16 and W25X32 support standard SPI clock rates of up to 75MHz. This performance can be further improved to an equivalent of 150MHz clock rate (>18MBps) by using the optional Dual-Output Read instruction. The instruction provides two bits of data per clock while maintaining the same 4-pin SPI interface. The "double data rate" makes the 25X family the highest-performance serial flash available today, according to Winbond, allowing controllers to quickly shadow or cache code to RAM and even execute code directly from the SPI interface.

The W19B160 started sampling in February 2007 while W19B320 will start in April 2007. Mass production of both products will be in Q2 2007. Alternate packages include 48-pin TSOP and 48-ball TFBGA. W19B640C samples will be available Q4 2007 while mass production is planned for Q1 2008. 48-pin TSOP and 48-ball TFBGA are both available.

The W25X16VSSIG and W25X32VSSIG started sampling in February 2007, with mass production scheduled in Q2 2007. Alternate packages include SO16 and WSON.

Winbond is showcasing its products at the 12th International IC-China Conference & Exhibition in Shenzhen, Beijing and Shanghai on March 5-14.

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