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Components take floor at 12th IIC-China

Posted: 05 Mar 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? Fairchild? National Semiconductor? STMicroelectronics? International Rectifier?

With more than 200 exhibitors spreading an array of leading-edge technologies in over 900 booths, the 12th International IC China Conference and Exhibition (IIC-China) is clearly China's largest IC event. The road show kicks off in Shenzhen March 5-6, proceeds to Beijing March 8-9 and culminates in Shanghai March 13-14.

Highlighting China's emerging status as a design powerhouse, this year's show is training the spotlight on local IC design houses in a special IC Design Pavilion. At the show's Shenzhen leg, a special Components Pavilion houses over 150 booths featuring active components, electromechanical components, electronic production equipment and supplies, interconnects, passive components, subassemblies and parts. These components drive product innovation and address the growing complexity of electronic design brought about by the ever-increasing demand for smaller and feature-rich applications.

Circuit protectors, passives
Last year's multiple product recalls and the ensuing safety regulations point to the need for secure and reliable system components. To meet these safety requirements and address the increasing complexity of miniaturized product designs, engineers rely on circuit protectors that deliver overcurrent, overvoltage and undervoltage protection, and withstand adverse temperature and polarity conditions. Designers can survey a host of these tiny circuit protectors at the show, particularly surface-mount fuses that account for half of all fuse products on exhibit. Booths to visit for this type of products are those of Fuzetec Technology Co. Ltd, Xiamen Set Electronic Co. Ltd and SART Fuse Co. Ltd.

Although some devices already have integrated voltage protection, they still need protective elements like gaseous discharge lamps, transient voltage suppression diodes and thyratron or zinc oxide varistors to provide extra shield from transient and surge voltages. These products are featured at the booths of Lite-On Semiconductor Corp. and Huaxing Electronic Devices Ltd.

More than 200 exhibitors will display cutting-edge technologies at IIC-China.

Capacitors make up 40 percent of the total yield of electronic components, and at least 90 percent of these are electrolysis condensers (including the aluminum/tantalum electrolytic capacitors), porcelain capacitors and organic film condensers. The growing competition in the capacitor market is apparent at the exhibition floor as manufacturers try to outdo each other's achievements in ESR reduction and SRF enhancement. Each vows to enhance rated waveform current to cut mounting area and product height, as well as prolong the service life of their products. Exhibitors specializing on chip inductors, resistors and capacitors include Shenzhen Sunlord Electronics Co. Ltd, Shenzhen CSG Electronics Co. Ltd, Open China International Enterprise Co. Ltd, Fujicon Electric Co. Ltd and Zonkas Electronic Co. Ltd.

For PCB designers scouting for DFM services supporting the European Union and China RoHS directives, the show provides a convenient avenue to meet with manufacturers. Among exhibitors offering DFM services are the Xingda Group, Aoshikang Precision Circuit (Hui Zhou) Co. Ltd, Pointers Circuits Ltd, Picotec International Co. Ltd and LPKF (Tianjin) Co. Ltd. Most of these firms are able to produce PCBs with two to 24 layers, minimum line width of 0.076mm and minimum aperture of 0.1mm. Some are able to manufacture high-end products like HDI PCBs or precise resistance controllers. Most have experience with RoHS-compliant designs, using environment-friendly materials and manufacturing processes.

EMC, power management
Because unmanaged EMI could lead to system or equipment failure, designers must discover the source and route of the EMI transmission, and then use the right way to implement sound designs. Various products that effectively address EMC, including bead arrays, inductors and filters, are showcased at the booths of Shenzhen Sunlord Electronics Co. Ltd and Tecstar Technology Co. Ltd.

Latest solutions from international power-management specialists, including Texas Instruments Inc. (TI), Fairchild Semiconductor Corp., National Semiconductor Corp., STMicroelectronics, International Rectifier, Micrel Inc., Intersil Corp., Linear Technology Corp. Ltd, ON Semiconductor and Maxim Integrated Products are on show. These solutions were designed to be highly integrated to enable smaller power supplies for streamlined devices in the communications, CE and automotive markets.

Israel's PowerDsine is showcasing PoE equipment and chips that boost power in WiMAX antennas. Taking advantage of the emerging market for digital power technologies, TI, Microchip Technology Inc., Zilker Labs Inc., Primarion Corp. and Silicon Laboratories Inc. are ramping all-digital control loops and PMBus in the field.

Audio amps, interfaces
Class-D audio amplifiers are highly efficient and require less board space, thus they are favored by many IC suppliers. These amplifiers can be used in high-power-output devices like flat-panel TVs, as well as in portable devices such as cellphones. TI has integrated a self-adaptive dynamic control circuit in its newly launched class-D amplifiers to improve tone quality when the amplifier is working under high power.

ON Semi's class-D amplifier increases audio output power to 1.3W and is also able to raise output impedance, thus eliminating noise when a cellphone switches between calling mode and handsfree mode. Other companies showcasing amplifiers are Linear Technology and Analog Devices Inc. (ADI).

The PCIe bus is now breaking into the comms and CE markets after proving itself in computing. IC manufacturers like NXP have launched an array of PCIe chips for these new markets. HDMI, on the other hand, is the interface of choice for HD flat-panel TVs, and HD DVD and Blu-ray disc players. ADI is showcasing a multiplexer, receiver and transmitter supporting HDMI 1.3. Fairchild's multimedia switches apply a super-compact UMLP packaging that integrates USB and audio switches with negative swinging. This high integration level reduces component count, resulting in smaller portable media devices.

To get free tickets to the one-stop IC and electronic component exhibition, log on to www.iicexpo.com/dcra.

- James Chen, Echo Zhao
EE Times-China

Christine Telesforo contributed to this article.




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