TSMC to step up production at Shanghai fab

Industry sources reported that Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) will ramp up the monthly capacity at its 8inch fab in Songjiang, Shanghai to 90,000 wafers by midyear. The Taiwan government allowed TSMC to process 0.18μm wafers at the company's mainland China facilities.

According to reports, TSMC will purchase equipment from NXP's 8inch fab in Europe. The equipment can process 30,000 wafers per month. TSMC, however, has not confirmed the transaction.

In related news, TSMC will receive OEM orders for chips to be used in AMD's next-generation Fusion processor. Fusion-based processors, which are currently being developed, will integrate CPU and graphics processor unit on one die.