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ADSL2+ SoC for CPE rolls for emerging markets

Posted: 23 Mar 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Wi-Fi? ADSL2+? CPE? Infineon? modem?

Infineon Technologies has announced a new ADSL2+ SoC for consumer premises equipment (CPE) that will help drive broadband penetration in emerging markets. Amazon-SE, the third generation of the Infineon ADSL/2/2+ CPE chip solutions, target bridge-modem and USB modem applications. The chip's integrated design helps cut the external components count of an ADSL2+ modem by as much as 10 percent compared with existing solutions, lowering BOM costs and reducing system complexity.

Offered in a PG-LQFP-144 package, the Amazon-SE allows for a two-layer PCB design. In USB modem applications, the device eliminates the need for an external power supply and removes the flash memory component totally by powering and booting the modem from the user's PC.

Amazon-SE features integrated SD/MMC and SPI interfaces, as well as PPE to enable the design of Wi-Fi ADSL2+ gateways with boosted routing performance, allowing system integrators to offer a broader range of ADSL2+ solutions based on a single HW/SW architecture.

Supporting all ADSL2+ standards, Amazon-SE provides line-rate throughput of up to 30Mbps (downstream) for all packet sizes in bridge-modem applications.

"With the Amazon-SE, Infineon provides its customers with an optimized solution to address the emerging broadband markets," said Christian Wolff, senior VP of the communication solutions business group and general manager of the wireline access business unit at Infineon. "The Amazon-SE is the newest member of our CPE product family that enables system providers to serve multiple applications and markets using the same HW/SW platform."

Engineering samples of the Amazon-SE are available with production ramp-up planned for Q2 2007.

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