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Winbond sells 200mm fab for $251M

Posted: 26 Mar 2007 ?? ?Print Version ?Bookmark and Share

Keywords:200mm fab? DRAM? flash? fab? Winbond?

Winbond Electronics Corp. Board of Directors has approved the deal to sell the 200mm fab in Hsinchu Science Park to Vanguard International Semiconductor Corp. (VIS) for about $251 million.

The trade includes factory, facilities, manufacture equipments, and parts. Both companies signed a long-term foundry contract from January 2008 to December 2011. VIS said that they will give precedence to approximately 700,000 pieces of wafer foundry service to Winbond.

The 200mm fab focuses on DRAM manufacturing and has achieved 40,000 pieces per month that can be used to manufacture 0.11? DRAM product and 0.13?m flash product. Despite this, the 200mm fab lost its competitiveness with the 300mm fab becoming the mainstream of memory IC manufacturer and process technology going 90nm and below. After the sale of 200mm fab, Winbond will be able to transfer the capital and intellectual people to Central Taiwan Science Park (CTSP) for its 300mm fab expansion.

Winbond's wafer testing and R&D departments in the 200mm site will rent the office from VIS temporarily. They are expected to be transferred gradually to CTSP factory and the new R&D building in front of THSRC Chupei Station in two years.

The contract of asset transaction will be signed in the end of March and the formal asset transfer is scheduled to take place on Jan. 1, 2008. In next 9 months, VIS will assist Winbond in implementing the logic process technology in the 200mm fab.

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