Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

ST reduces package size of serial EEPROM line

Posted: 30 Mar 2007 ?? ?Print Version ?Bookmark and Share

Keywords:serial EEPROM? memory chips? MLP8 package?

Serial EEPROM chips in new MLP8 package from ST

STMicroelectronics has announced that all its serial EEPROM devices, from 2Kbit to 64Kbit densities, and from both the SPI and I?C interface series, are now available in the tiny 2-by-3mm MLP8 package, enabling significant space and cost savings for portable consumer and communications products.

ST claims to be the first to market a comprehensive "low-density" serial EEPROM range in this package size. The ultrathin (0.6mm), fine-pitch, dual flat MLP delivers improvements compared to other packages, and the product families offer footprint compatibility throughout the 2-64Kbit density range.

The tiny memory chips in the M24 (I?C bus interface) and M95 (SPI bus interface) families operate over a 1.8-5.5V supply-voltage range, and are specified to function for more than 1 million write cycles and to retain data for more than 40 years. They are suitable for compact CE applications, such as digital cameras, camcorders, MP3 players, remote controls and games consoles, as well as in communications products including cellphones, handsets and Wi-Fi, Bluetooth and wireless-LAN cards.

All serial EEPROM devices in the new packaging size are available in volume, except the 64Kbit I?C variant, which will enter volume production in 2H 2007. Samples of all devices are available.

Article Comments - ST reduces package size of serial EE...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top