Samsung mobile solution combines application processor, OneDRAM

Samsung Electronics Co. Ltd has announced the development of a key semiconductor solution for mobile applications such as smartphones, PMPs and portable navigation devices (PNDs). The new package-on-package (PoP) solution incorporates the company's application processor and OneDRAM proprietary fusion memory.

By combining these two key components in a single solution, Samsung claims mobile application designers can enjoy the benefits of smaller area coverage on the PCB, reduced inter-chip noise and faster performance. The initial applications for the new solution are 3G and 3.5G smartphones, and are expected to gradually expand to PMPs and PNDs.

OneDRAM fuses into a single chip the memory functions required to interact with the modem and application processors, and undertakes the role of supporting RAM for both mobile processors. This fusion semiconductor holds a shared block for the inter-processor data transfer.

Samsung's S3C6400 application processor incorporates a 667MHz ARM1176 core, a high-quality video streaming capability of standard definition, and interfaces supporting an SVGA LCD display, a 16Mpixel camera input and wireless connectivity such as Wi-Fi, Bluetooth, GPS, WiBro and DVB-H.

The PoP solution integrates the mobile application processor with a MCP memory solution. The MCP can be configured with different types of high-density memory chips like 4Gbit NAND/OneNAND, 512Mbit SDRAM and 512Mbit OneDRAM.