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Solder paste with SACX alloy delivers high throughput

Posted: 16 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Pb-free solder paste? SACX alloy? high throughput? ALPHA OM-350 solder paste?

Seeking to provide the SMT printing performance required by electronics assemblers looking for high throughput and minimal returns of defective products, Cookson Electronics Assembly Materials adds to its offering the new ALPHA OM-350 Pb-free solder paste with SACX Alloy developed by the Cookson Electronics' R&D group.

"We have found that many of our customers making the switch to Pb-free processing are making choices between acceptable throughput levels and defects. ALPHA OM-350 with the SACX alloy, provides the overall process performance they require," said Cookson Electronics' Global Product Manager, Mitch Holtzer. "It has excellent print definition, print cycle times from 25mm/s to 100mm/s, excellent reflow yield performance and passes IPC, Bellcore and JIS electrical reliability requirements."

ALPHA OM-350 with the SACX alloy demonstrates advanced stencil life and print volume repeatability. Its voiding resistance exceeds IPC 7095 Class III requirements for low voiding, and its joint appearance is equal to more expensive SAC 305.




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