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RF/Microwave??

Low profile MEMS microphone is slim at 1.05mm

Posted: 22 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:slim MEMS microphone? 1.05mm thick microphone? portable applications?

Matsushita Electronic Industrial Co. Ltd has launched a slim MEMS microphone suitable for portable electronic devices such as mobile phones.

The new MEMS microphone is constructed from an acoustic transducer (MEMS chip) made of MEMS technology and a CMOS amplifier, realizing low profile, at the same time, high heat resistance which enables Pb-free reflow solder mounting.

The MEMS microphone can help reduce the height of portable electronic appliances, as well as lower the mounting cost in their production process, said the company. The device also features a high heat resistance of 260C, which is required by Pb-free automatic reflow solder for PCB surface mounting.

The product also features less sensitivity change even after Pb-free reflow solder mounting (260C, three times) with stable high heat resistance. Moreover, the newly developed CMOS amplifier enables portable electronic appliances to have low power consumption and achieve an "anti-noise" design.

The new MEMS microphone incorporates several technologies including a solid metal shield structure and mounting technology that helps realize the device's 1.05mm low profile. It also features a newly developed technology of high heat resistance inorganic multilayer electret diaphragm formation and a CMOS amplifier design technology to enable low power consumption, low noise and low output impedance.

Sample shipment of the product will start by end of the month.




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