Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Common Platform, partners extend chip pact to 32nm

Posted: 25 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Common Platform? 32nm node? manufacturing partners?

Common Platform members IBM, Chartered Semiconductor and Samsung Electronics, along with joint-development alliance partners Infineon Technologies and Freescale Semiconductor, announced plans to extend their chip development pact to the 32nm node.

The partnership among these companies previously covered 45nm. With the new joint-development agreements, it will now include 32nm bulk CMOS process technologies.

The partners plan to pool their combined expertise and collaborate to design, develop and manufacture advanced technology through 2010. As with previous nodes, 32nm development activities will be conducted at IBM's 300mm fab in East Fishkill, New York, U.S.A.

The five companies will work together to deliver 32nm processes, based on ultra low-k dielectrics, high-k, metal gates, strained silicon and other technologies. It will also develop chips based on a second-generation immersion lithography technology.

IBM will enter into 32nm ''product qualification by year-end 2009,'' said Steve Longoria, VP for the common platform technology at IBM. Chartered and Samsung will move into 32nm production one quarter after IBM, he said.

Longoria added that IBM will move its high-k technology into production at the 45nm node for processor products. This includes the company's own processor as well as its PowerPC lines for game machines.

- Mark LaPedus
EE Times




Article Comments - Common Platform, partners extend chi...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top