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Inverter IC trims power use in white goods

Posted: 30 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:single-chip inverter? BLDC motor drives? intelligent power module? white goods?

Mitsubishi Electric Europe's M81500FP single-chip inverter

Mitsubishi Electric Europe B.V.'s Semiconductor European Business Group announces a new single-chip inverter for drives of typically 90W, addresses brushless DC (BLDC) motor drives solutions, for significant energy savings while simultaneously meeting the specific demands of the white good industry.

The new single-chip device named M81500FP, which is rated for 500V/1A, integrates control, drive and protection functionalities as well as IGBTs, freewheeling diodes and bootstrap diodes. The device protects against undervoltage, interlock, short circuit and overtemperature while simultaneously providing an open drain fault output (FO). As the M81500FP is able to turn off the device under short circuit conditions within 1?s, this intelligent power module provides an efficient short circuit protection with excellent robustness.

"Up to now manufacturers of dish washers, compressors for refrigerators or small pumps for heating systems often had to refrain from using electronic motor control due to space and cost restraints," says Van Trung Nguyen, general manager, Power Semiconductors Europe at Mitsubishi Electric Europe. "By using our intelligent power module, they will be able to enter a new era in electronic motor control and provide a significant contribution to reduce the overall power consumption of white goods. Compared to a discrete solution using DPAK transistors and SO-8 high-voltage ICs, M81500FP does not only reduce the PCB space requirement by 55 percent to less than 210mm? but it also reduces the overall system cost in a way that BLDC motors can now be used in the non-premium segments of white goods as well. For the consumer this does not only result in significant energy savings but also in smoother, more silent operation, which in turn opens up new marketing and sales opportunities for the manufacturers."

M81500FP requires minimum number of (just three) passive components to operate the single-chip inverter IC: one ceramic bootstrap capacitor, one 1206-class shunt resistor and a ceramic capacitor at the voltage supply pin. As all the logic input pins are compatible to 3V and 5V logic, M81500FP can be directly connected to (and controlled by) MCUs and DSPs.

The chip uses Mitsubishi Electric's advanced transfer mold packaging technology that offers excellent heat conduction capabilities. This enabled M81500FP to be not only the world's smallest intelligent power module (IPM) for the 90W range (requiring just 17.5-by-11.93mm on the PCB) but is also the first IPM on the market that is integrated in an SMD package, which significantly simplifies the production process. As cost-sensitive white goods and similar devices are manufactured on highly automated production equipment, surface mount components are preferred by the manufacturers to optimize production cost.

M81500FP is manufactured in silicon on insulator technology by using a 1.3?m HVIC process. The power stage is formed by lateral n-channel IGBTs, while the control part is implemented by using a 24V CMOS technology with HV-NMOS structures for level-shifting.

An evaluation board (EVBM81500FP) allows designers to get familiar with the device. The evaluation board measuring just 59-by-38mm already contains an MCU (NEC ?PD78F0712) and demonstrates the compactness of the core function of a small drive system realized by the M81500FP.

- Henri Arnold
EE Times Europe

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