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3.3V, 20Mbaud high speed IC photocoupler rolls

Posted: 30 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:high speed IC photocoupler? Pb-free?

TAEC's 3.3V, 20Mbaud high speed IC photocoupler

Toshiba America Electronic Components Inc. (TAEC) unveils its first 3.3V, 20Mbaud high speed IC photocoupler, the TLP2066.

The product addresses isolation requirements and switching noise elimination in switching power supplies, instrument I/O, computer peripheral interfaces, high speed disk drive I/O, microprocessor system interfaces, bus drivers for networking applications and high speed logic systems.

The 3.3V device achieves a level of performance similar to Toshiba's 5V, 20Mbaud TLP116 IC photocoupler, at a lower operating voltage. Moreover, it features a high tolerance for noise, with a common mode transient immunity ratio (CMR) of 15kV/ms, compared to theTLP116's CMR of 10kV/ms.

TLP2066 is offered in a compact 5-pin MFSOP6 package, measuring only 4.4-by-3.6-by-2.5mm, making it suited for space-constrained applications. The new optocoupler also features a wide operating temperature range of -40C to 100C, and is compatible with the Pb-free 2 reflow solder process and RoHS-compatible 3 requirements.

Samples of the 3.3V, 20MBd TLP2066 are available now. Pricing starts at $1.50 each.




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