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Multichip package's capacity swells to 4Gbyte

Posted: 01 Jun 2007 ?? ?Print Version ?Bookmark and Share

Keywords:3G mobile phones? 3G? external memory card? flash?

Samsung Electronics Co. Ltd is bumping up the storage capacity in 3G mobile phones with a 4Gbyte multichip package that it says will prompt some phone makers to design out external memory card slots.

The multichip package is dubbed moviMCP. It combines a 4Gbyte embedded memory card, consisting of two 16Gbit NAND flash chips and a controller, along with a 1Gbit mobile DRAM chip to support the processor and a 2Gbit NAND flash chip for general handset operations, the company said.

Samsung used an eMMC interface, based on the MultiMediaCard Association standard for embedded memory, which it said resolves the design complexity inherent in the functional differences of the various types of NAND flash by integrating an embedded controller into the moviMCP. This removes the need to develop interface software for each type of NAND flash.

"We've now perfected a memory chip that allows handset manufacturers to significantly reduce development time while deploying an extremely robust design that will result in higher performance for smaller phones, with higher storage capacities," said Jim Elliott, director, flash marketing director, Samsung Semiconductor Inc.

Sales of 3G phones may hit 392 million units this year and show an approximately 40 percent CAGR from 2007 through 2010, according to iSuppli Corp.

Samsung said the device is ready for sampling.

- Mike Clendenin
EE Times

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