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A design and manufacturing guide for Lead Frame Chip Scale Package

Posted: 31 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:lead frame? chip scale package? design guide? manufacturing guide?

ADI's Gary Griffin provides design and manufacturing guidance on the use of LFCSP, a packaging standard compliant with JEDEC MO220 and MO229 outlines.

View the PDF document for more information.

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