TSMC eyes 2009 for 32nm jump

Taiwan Semiconductor Manufacturing Co. Ltd is looking to unveil the 32nm process, the next step after the 45nm process in CMOS manufacturing and fabrication, in two years' time, according to a DigiTimes report.

The tech news Website quoted the chip foundry's VP Jack Sun as saying that the firm has hired more than 200 engineers to develop the 32nm process, with an eye for a launch in Q4 2009. Preliminary research into the 22nm process has also begun, he added.

Sun said TSMC is on track to start mass production under the 45nm node, with a test-run on the general-purpose and high-performance process slated for May 2008.