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AMD chips permit fanless embedded designs

Posted: 07 Jun 2007 ?? ?Print Version ?Bookmark and Share

Keywords:fanless system design? processor? embedded design?

<a href=AMD's Sempron processor model 2100+" ALIGN="RIGHT">

AMD expanded its embedded solutions offerings to include the AMD Sempron processor model 2100+ and the AMD Geode LX 800 at 0.9W processor, which can now support designs tailored for harsh-temperature environments.

The AMD Sempron processor model 2100+ offers fanless system design and incorporates AMD64 technology in a 9W-power envelope. AMD is aiming this processor at designers focused on delivering high performance and functionality in single board computing and embedded client systems.

The AMD Sempron Processor Model 2100+ is compatible with the recently announced AMD M690T chipset.

It also features high shock and vibration specification Socket S1, offering high reliability for ruggedized computing. Applications such as telecommunications infrastructure (including wired, wireless and MSB/MSC), single board computing, automotive and transportation systems, and industrial control and monitoring often require temperature support in the -40C to 85C range, which can now be supported with the AMD Geode LX 800 at 0.9W processor.

Several embedded board manufacturers have products available that will accommodate the extended temperature AMD Geode LX processor, including Advantech, AAEON, Arbor, ICP and IBase, while both AAEON and Arbor offer boards that will accommodate the new AMD Sempron processor Model 2100+.

- Ismini Scouras
eeProductCenter




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