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ST, Freescale sound progress in automotive design

Posted: 25 Jun 2007 ?? ?Print Version ?Bookmark and Share

Keywords:automotive design? IP development? MCU? collaboration?

Freescale Semiconductor and STMicroelectronics Inc. have leveraged on a cooperative deal with an announcement on advances in the areas of automotive IP development, flash technology alignment and new product definition.

The two companies' automotive units signed the joint design initiative last year.

They have since focused product development efforts on a wide range of automotive applications using Power Architecture technology as well as moved aggressively to design and manufacture test chips in 90nm embedded flash technology, the two firms said in a joint press release.

"Our customers are keenly interested in the forthcoming automotive MCU designs resulting from our joint development efforts," said Mike McCourt, VP and general manager of Freescale's MCU division. "In addition to our combined product and process technology capabilities, the dual-sourcing capabilities we plan to bring to the market are also generating a lot of interest in the automotive industry."

McCourt said that four new products are slated to debut early next year. "We expect to roll out a comprehensive roadmap of scalable MCU designs within the next couple of years," he further revealed.

The companies' design centers in Naples, Agrate, Sao Paulo and New Delhi, staffed with a total of 130 engineers, are dedicated to developing MCU products for specific automotive market segments.

Marco Maria Monti, VP and general manager of ST Powertrain and Safety Division, said his company's collaboration with Freescale has proved "extremely effective," especially in the development of flash memory.

"The first test chips, based on 90nm embedded flash technology, are under validation and are showing very good results," he said. "We plan to offer customers a fully scalable roadmap from very cost-effective flash-based MCUs for car body applications up to very high-performance products for advanced powertrain and chassis systems."

Lead customers are expected to receive samples of the jointly developed products within the first three months of 2008.

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