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Atmel fields 'first' 128Kbit Serial EEPROM in MLP housing

Posted: 11 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Serial EEPROM? Bluetooth modules? RoHS?

Atmel Corp. unveils the industry's first 128Kbit Serial EEPROM device in an 8-pin ultra thin MLP (2-by-3mm) leadless package with overall height of 0.60mm.

The 8-pin ultra thin MLP (2-by-3-by-0.60mm) package is now offered in densities of 1-128Kbit for the two-wire Serial EEPROM (AT24) and 1-64Kbit in the SPI Serial EEPROM (AT25) family. This package is suited for compact and portable consumer applications such as MP3 players, digital cameras and remote controls. Moreover, the MLP package fits a wide range of height constrained communication applications including, Bluetooth modules and mobile phones. Traditionally, the MLP (2-by-3mm) package has been limited to low density Serial EEPROM devices. Atmel claims to be the first to market the package for high-density Serial EEPROM devices up to 128Kbit. Previously, the highest available density in a 2-by-3 mm MLP was a 32Kbit Serial EEPROM.

"Fitting a 128Kbit Serial EEPROM in an ultra thin MLP package offers designers with maximum flexibility, in board space savings and overall height, while maintaining the capability to migrate up in density from 1Kbit up to 128Kbit without changing the board layout," said Bassam Khoury, managing director for the serial interface product line.

The ultra thin MLP (2-by-3mm) package is available now in densities from 1Kbit up to 128K-bit in the two-wire family and 1Kbit up to 64Kbit in the SPI family. The 8-pin MLP package is offered in a Pb-Free (green), halogen-free and RoHS compliant packaging with the industry's high reliability NiPdAu finish.




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