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Manufacturing/Packaging??

RFMD expands Beijing plant capability

Posted: 19 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:assembly plant? RF solution? transmit module?

RF Micro Devices Inc. (RFMD) will expand its Beijing facility to include increased assembly capacity and new advanced capabilities. The expansion is expected to support the company's POLARIS 3 RF solution, which is currently scheduled to ramp production in the current quarter.

The increased capacity will approximately double assembly capabilities related to RFMD's transmit modules. Capacity of wire bond and test capabilities will be expanded in the current quarter, and full capacity will be available by November 2007. In addition, new advanced capabilities added in RFMD's Beijing facility will include flip chip packaging technology and the company's patent-pending internal RF shielding technology.

RFMD is also developing proprietary RF test platforms internally, as well as working in conjunction with third party suppliers, for advanced transceiver module testing. At completion, the expansion and new enabling technologies are expected to streamline RFMD's supply chain, speed time to market and reduce manufacturing and inventory carrying costs.

"We are introducing new enabling technologies that support our market leadership in cellular front ends and position RFMD to deliver more highly integrated RF solutions that reduce overall costs and increase our dollar content in current- and next-generation cellphones," said Bob Bruggeworth, RFMD's president and CEO. "We expect our Beijing facility expansion will positively impact our ability to meet demand for our POLARIS 3 RF solution, as it ramps in the coming months and grows sequentially throughout calendar year 2008."




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