Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Sematech doubles 450mm efforts

Posted: 19 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:wafer fabs? 450mm? R&D?

International Sematech has announced the launch of a new and dedicated 450mm fab R&D program. In effect, Sematech will now have two separate and parallel 450mm efforts. The new program is bound to upset most chip-equipment companies, which lack the R&D dollars to move to the next-generation and costly wafer size.

In the past, chipmaking consortium Sematech backed a program called 300mmPrime. This program was supposed to improve the overall efficiency of 300mm fabs and, at some point, serve as a bridge or transition to the 450mm fab.

Tom Abell, 450mm program manager at Sematech, said that 300mmPrime falls short of the cost reduction requirements to stay on Moore's Law.

Sematech will still back 300mmPrime, but it will also support a new and direct 450mm program starting in 2008.

450mm fabs are not expected to emerge until 2012 or later. Only a few companies can afford to build these fabs, namely Intel, Samsung and perhaps TSMC.

- Mark LaPedus
EE Times

Article Comments - Sematech doubles 450mm efforts
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top