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Amkor, IMEC sign 3D wafer-level packaging pact

Posted: 19 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:3D systems? IC packaging? nanotechnology?

Amkor Technology Inc. has agreed to develop 3D integration technology with the Belgium-based IMEC nanoelectronics and nanotechnology research center. The two groups announced the two-year collaboration agreement this week. The project will be based on Amkor's wafer-level processing techniques. "This collaboration with IMEC will enhance our continuing efforts to develop low-cost, state of the art packaging solutions for our customers," Dan Mis, Amkor senior VP for wafer level advanced product development, said in a joint press release.

Luc Van Den Hove, IMEC's executive VP and chief operating officer, also hailed the partnership. "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."

Amkor provides advanced semiconductor assembly and test services. IMEC specializes in SoC, VLSI and ULSI platforms, and on the enabling technologies for ambient intelligence.

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