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Qimonda ships samples of 75nm Mobile DRAM

Posted: 24 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:75nm Mobile DRAMs? system-in-package? mobile memory?

Qimonda is sampling its first 512Mbit Mobile DRAMs in 75nm geometries. The devices are precursors for an entire product family, the company said.

The company uses a specifically designed 75nm low-power trench technology platform as the basis for a Mobile DRAM product family for this geometry node. The new chip that is sampling now is available as DDR and SDR, the company said. It comes, via bond option, with 16- and 32bit interfaces and specifically designed pads to fit multichip packages (MCP) or system-in-package (SIP). Compared to standard DRAM, the ultralow power mobile memory device reduces power consumption by up to 80 percent, the company claims.

"We are very glad to introduce this 75nm low-power Mobile RAM, which is the lead product for an entire family following in the next six months", said Ayad Abul-Ella, VP of consumer and mobile business unit, Qimonda. Abul-Ella also announced innovative packaging and testing services for the product family. Samples are available as component or as KGD (Known Good Die) wafer.

- Christoph Hammerschmidt
EE Times Europe

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