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NXP, Collis hold ePassport training in Singapore

Posted: 31 Jul 2007 ?? ?Print Version ?Bookmark and Share

Keywords:biometrics? smart card? contactless IC? e-passport?

NXP Semiconductors has teamed up with Collis BV to provide training for Singapore's electronic passport program. The Netherlands-based chipmaker said the two firms hosted a training course for technology vendors and local government agencies at NXP's Toa Payoh facilities recently. Technological hurdles involving the high-tech travel document and how to overcome them topped the agenda.

The two-day session gave participants a glimpse into an ePassport user's point of view. In-depth discussions were also held on topics such as the format requirements for the logical data structure and the correctness of the public key infrastructure, NXP said in a statement.

"There is a clear need worldwide for solutions on e-passport implementation and achieving a successful outcome especially in terms of interoperability," commented Rick Hsu, managing director at Collis Asia, a world leader in consulting, testing tools and training for emerging technologies. "Partnering with NXP ensures that in-depth knowledge and technical expertise is made available to government agencies and vendors to successfully overcome the challenges of e-passport implementation."

Arthur Pok, Asia-Pacific marketing director for identification at NXP, also expressed delight over the success of the joint training session. "As governments around the world begin to issue e-passports in their own countries, the expertise offered by Collis throughout the ecosystem makes them the ideal partner for education, consulting and testing of implementations," he said.

Singapore is among 37 nations, including the U.S., that have chosen NXP's secure, contactless smart chips for embedding on citizens' passports.




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