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SoC is housed in DIL32 module package

Posted: 01 Aug 2007 ?? ?Print Version ?Bookmark and Share

Keywords:system-on-chip? SoC DIL32 module package? pluggable embedded module?


Beck IPC GmbH said that the new member of the IPC@CHIP seriesthe SC23 combines both performance and the features of the SC123/SC143 with the tried and tested simple handling of the SC12/SC13.

With its pluggable DIL32 housing, the SC23 is designed for applications that benefit from the use of a pluggable embedded module for optimum convenience in manufacturing and service.

Like the established plug technology of the SC12/SC13 devices, the new SC23 with the IPC@CHIP RTOS is naturally also software compatible with SC12/SC13 and SC123/SC143 but also offers a host of innovations. Processor and memory with 96MHz clock frequency, 8Mbyte RAM and 2Mbyte flash are the same as the SC123. The modern 3.3V design reduces the current consumption and the parallel address/data bus was replaced with an SPI and I?C bus interface. RS232/TTL interfaces are provided and 17 GPIO pins enable the direct control of the local I/Os. In addition to this are two CAN2.0 interfaces and a USB host/device interface.

A development kit, the DK55, will be provided to enable designers of fast entry and an immediate start on application development.

The DK55 development kit will be available in December. The SC23 will be supplied as a series product from January 2008. Preliminary versions of the development kit and SC23 samples are already planned for October.

- Henri Arnold
EE Times Europe

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