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Kontron debuts smallest- footprint COM spec

Posted: 07 Aug 2007 ?? ?Print Version ?Bookmark and Share

Keywords:Computer-On-Modules? PCIe-based COMs? SoC technology?


Three years after the 2004 launch of the ETXexpress specification, which has become the PICMG COM Express (COM.0) standard, Kontron AG defines a new footprint variant of the Computer-On-Modules (COMs) standard: nanoETXexpress.

The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid- to high-performance x86 technology on a footprint that is a mere 55mm x 84mm. This is 39 percent of the original COM Express module Basic form factor 125mm x 95mm footprint and 51 percent of microETXexpress (95mm x 95mm). This new COM form factor follows the PICMG COM Express standard and will be 100 percent compliant with the COM.0 Type 1 connector. The locations of the identically mapped pin-outs will also be 100 percent COM.0 compliant.

The goal of nanoETXexpress specification is to build PCIe-based COMs on the smallest possible form factor. Many new applications that will benefit from the nano-size include hand-held units for medical, mobile data solutions and other emerging applications that have not been possible as of yet due to size restrictions.

The nanoETXexpress specification will provide the ideal footprint for future applications, bearing in mind that forthcoming processor and SoC technology will be delivered in 45nm technology and beyond," said Dirk Finstel, CTO Embedded Modules Division, Kontron.

The specification, documentation for nanoETXexpress will be available under a non-disclosure agreement in Q4 2007. Kontron plans to launch its first nanoETXexpress based COM in Q2 2008.

- Henri Arnold
EE Times Europe

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